ESP8266 has powerful on-board processing and storage capabilities that allow it to be integrated with the sensors and other application specific devices through its GPIOs with minimal development up-front and minimal loading during runtime. Its high degree of on-chip integration allows for minimal external circuitry, and the entire solution, including front-end module, is designed to occupy minimal PCB area.
Features:
- SDIO 2.0, SPI, UART
- 32-pin QFN package
- Integrated RF switch, balun, 24dBm PA, DCXO, and PMU
- Integrated RISC processor, on-chip memory and external memory interfaces
- Integrated MAC/baseband processors
- Quality of Service management
- I2S interface for high fidelity audio applications
- On-chip low-dropout linear regulators for all internal supplies
- Proprietary spurious-free clock generation architecture
- Integrated WEP, TKIP, AES, and WAPI engines
Specification:
- 802.11 b/g/n
- Wi-Fi Direct (P2P), soft-AP
- Integrated TCP/IP protocol stack
- Integrated TR switch, balun, LNA, power amplifier and matching network
- Integrated PLLs, regulators, DCXO and power management units
- +19.5dBm output power in 802.11b mode
- Power down leakage current of <10uA
- Integrated low power 32-bit CPU could be used as application processor
- SDIO 1.1/2.0, SPI, UART
- STBC, 1?1 MIMO, 2?1 MIMO
- A-MPDU & A-MSDU aggregation & 0.4ms guard interval
- Wake up and transmit packets in < 2ms
- Standby power consumption of < 1.0mW (DTIM3)
